C/SiC刹车材料的摩擦磨损性能

通过化学气相渗透结合反应熔体浸渗法制备了三维针刺C/SiC刹车材料,利用光学显微镜、SEM和XRD研究了材料的组织结构,并通过电模拟惯性试验台测试了全尺寸C/SiC飞机刹车盘的摩擦磨损性能。结果表明,C/SiC刹车材料由35%~65%C,25%~55%SiC和约10%Si组成,SiC和Si主要分布在短纤维胎网层。在刹车压力相同时,随着初始刹车速度的增大,材料的平均摩擦系数先增大后减小,当初始刹车速度为150 km/h时,摩擦系数达最大值;当初始刹车速度相同时,摩擦系数随着刹车压力的增大而减小;材料平均磨损率约为1.0×10-3mm/(side.time)。在飞机正常着陆条件下,材料的刹车力矩与刹车速度间的关系与飞机防滑刹车系统的着陆响应相匹配,使得该材料具有较高的刹车效率。     

A hybrid chemical modification strategy for monocrystalline silicon micro-grinding: Experimental investigation and synergistic mechanism

For high performance manufacturing of micro parts and features, a hybrid chemical modification strategy is proposed to decrease critical energy barrier of mechanical removal of hard and brittle crystal material by refining localized machining condition. The strategy, namely UV-light and IR-laser hybrid chemical modification (UVIR-CM) strategy, includes two steps, an ultraviolet light (UV-light) catalytic advanced oxidation and an infrared laser (IR-laser) assisted selective modification based on Fenton liquid–solid reaction for monocrystalline silicon. The modification effects of UVIR-CM strategy were investigated by surface morphology micro-observation, cross-section transmission electron microscopy (TEM) observation, Raman spectroscopy analysis and nanoindentation test. Experimental results demonstrated that varied degrees of laser texturing appeared on different strategy samples’ IR-laser scanned area. And the IR-laser thermal damage has been successfully inhibited due to the refraction and reflection of energy by bubbles in liquid medium. But for the UVIR-CM strategy, a uniform and amorphous silicate layer is detected in a certain boundary. The UV-light promotes oxidation cycle ability of the chemical solution and ensures sufficient oxide modified layer for subsequent step. Attributing to synergism of photochemical, photothermal and kinetic effects induced by IR-laser, the modified layer displays layered structure with about 600 nm thickness, (2.7 ± 0.60) GPa nanohardness, and (93.7 ± 22.9) GPa indentation modulus. And the layered structure is amorphous layer, nanocrystal and micro-twins layer from the surface to the interior of sample. Consequently, it reveals that the subsequent mechanical removal will become easy due to decreasing energy barrier of monocrystalline silicon in selective area. Meanwhile, its original excellent mechanical properties also are maintained under a certain depth. The results contribute to develop a novel combined micro-machining technology to achieve collaborative manufacturing of structure shape and surface integrity for micro parts and feature.     

基于国产金锡焊料的功率芯片焊接工艺及可靠性研究

金锡焊料具有强度高、抗氧化性好、抗疲劳、蠕变性能优良等优点，在混合集成电路中得到越来越多的应用，尤其是在大功率高可靠集成电路中通过共晶焊接来降低封装热阻和提高芯片焊接可靠性。本文分析了国产金锡焊料的基础特性，基于国产金锡焊料采用手动方式进行功率芯片摩擦共晶焊接关键控制参数焊接工艺研究；对功率芯片金锡焊接宇航应用可靠性进行验证。结果表明，经历系列严苛的宇航环境热力学试验，剪切强度满足相关标准要求并保持强度稳定，显示了焊接的高可靠性。     

干式铣削Al-50wt%Si高硅铝合金刀具磨损与表面粗糙度评价

本文以Al-50wt%Si高硅铝合金为研究对象，采用单因素试验方法进行无涂层硬质合金刀具干式铣削试验，分析切削参数对刀具磨损和表面粗糙度的影响。结果表明：表面粗糙度受每齿进给量的影响最显著，随每齿进给量的增加而增加，当每齿进给量从0.07 mm/z增加到0.16 mm/z时，表面粗糙度增加2倍；刀具磨损受切削速度的影响最显著，随切削速度的增加而增加，当切削速度从140 m/min增加到260 m/min时，切削总长度降低3倍，而刀具后刀面磨损量仅是260 m/min速度下的0.8倍；表面粗糙度随刀具磨损的增加呈现先增加后降低的变化趋势，切削长度从350 mm增加到1 750 mm，刀具磨损量平均增加4.5倍，而表面粗糙度却下降2倍；硬质合金刀具主要的磨损形式为磨粒磨损、崩刃。