| 气膜孔出口覆盖多孔介质层对冷却效果的影响 |
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| 引用本文： | 刘元清,姜培学,王扬平.气膜孔出口覆盖多孔介质层对冷却效果的影响[J].航空动力学报,2008,23(3):460-464. |
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| 作者姓名： | 刘元清 姜培学 王扬平 |
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| 作者单位： | 清华大学,热能工程系,热科学与动力工程教育部重点实验室,北京,100084 |
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| 基金项目： | 航天863项目(2002AA722051) |
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| 摘 要： | 综合气膜冷却和发汗冷却的特点,提出一种在气膜孔出口局部覆盖多孔介质层的冷却结构,利用数值模拟的手段对比研究该结构与常规斜圆孔气膜结构的冷却效果,计算考虑了0.61,0.91和1.22三种吹风比,结果表明:由于多孔介质对冷却射流的扩散作用,该结构的壁面冷却效率高于气膜冷却,同时壁面温度梯度得到了有效的抑制,是一种适合于未来燃气轮机叶片的冷却结构.
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| 关 键 词： | 航空、航天推进系统 气膜冷却 发汗冷却 多孔介质层 数值模拟 |
| 文章编号： | 1000-8055(2008)03-0460-05 |
| 收稿时间： | 2007/3/13 0:00:00 |
| 修稿时间： | 2007年3月13日 |
Cooling performance induced by film holes with coverage of porous media layer |
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| LIU Yuan-qing,JIANG Pei-xue and Wang Yang-ping.Cooling performance induced by film holes with coverage of porous media layer[J].Journal of Aerospace Power,2008,23(3):460-464. |
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| Authors: | LIU Yuan-qing JIANG Pei-xue and Wang Yang-ping |
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| Affiliation: | Key laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China;Key laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China;Key laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China |
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| Abstract: | By attaching a layer of porous media coverage to the local zone around film-hole exits,a new cooling scheme which combines the features of film cooling and transpiration cooling was introduced in the present study.The cooling effects of the present scheme and the traditional cylindrical hole film cooling were compared numerically for three kinds of blowing ratio M=0.6,0.91 and 1.22.The results show that the new scheme provides higher wall cooling effectiveness and moderate temperature gradients,which enables it to be a better candidate for blade cooling for future high performance gas turbine. |
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| Keywords: | aerospace propulsion system film cooling transpiration cooling porous layer numerical simulation |
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