| 多环谐振微机械陀螺的研究现状及发展趋势 |
| |
| 引用本文： | 杜宜璋,常洪龙,苑伟政,谢建兵.多环谐振微机械陀螺的研究现状及发展趋势[J].导航与控制,2019(4):1-10. |
| |
| 作者姓名： | 杜宜璋 常洪龙 苑伟政 谢建兵 |
| |
| 作者单位： | 西北工业大学空天微纳系统教育部重点实验室，西安 710072,西北工业大学空天微纳系统教育部重点实验室，西安 710072,西北工业大学空天微纳系统教育部重点实验室，西安 710072,西北工业大学空天微纳系统教育部重点实验室，西安 710072 |
| |
| 基金项目： | 国家自然科学基金(编号：51775447） |
| |
| 摘 要： | 微机械陀螺是一种新型的陀螺，近年来随着微机电技术的发展，其性能不断得到提高。基于多环谐振微机械陀螺的发展现状，详细评述了多环谐振陀螺的来源以及其由单环到多环的结构发生改变的优点。并基于驻波进动原理，介绍了两种新型的全对称谐振盘陀螺。总结了圆环谐振式微机械陀螺的工艺发展路线，由早期的HARPSS工艺发展到外延多晶硅封装工艺，再到材料性能好的单晶硅热压键合工艺，使得多环谐振陀螺的性能不断得以提升，并分析了其优缺点。最后，展望了未来的高新技术，提出多环谐振陀螺的发展方向。
|
| 关 键 词： | 微机械环形陀螺 微加工技术 驻波进动原理 键合 |
Research Status and Development Trend of Multi-ring Resonant Micromechanical Gyroscope |
| |
| DU Yi-zhang,CHANG Hong-long,YUAN Wei-zheng and XIE Jian-bing.Research Status and Development Trend of Multi-ring Resonant Micromechanical Gyroscope[J].Navigation and Control,2019(4):1-10. |
| |
| Authors: | DU Yi-zhang CHANG Hong-long YUAN Wei-zheng and XIE Jian-bing |
| |
| Affiliation: | Key Laboratory of Aerospace Micro-Nano System, Ministry of Education, Northwestern Polytechnical University, Xi''an 710072,Key Laboratory of Aerospace Micro-Nano System, Ministry of Education, Northwestern Polytechnical University, Xi''an 710072,Key Laboratory of Aerospace Micro-Nano System, Ministry of Education, Northwestern Polytechnical University, Xi''an 710072 and Key Laboratory of Aerospace Micro-Nano System, Ministry of Education, Northwestern Polytechnical University, Xi''an 710072 |
| |
| Abstract: | Micromechanical gyroscope is a new type of gyroscope. In recent years, with the development of MEMS technology, its performance has been continuously improved. In this paper, based on the development status of multi-ring resonant micromechanical gyroscope, the sources of multi-ring resonant gyroscope and its advantages from single-ring to multi-ring structure are reviewed, and two new types of fully symmetric resonant disk gyroscope based on the principle of standing wave precession are introduced. Then, the process development route of the ring resonant micromechanical gyroscope is summarized. From the early HARPSS process to the epitaxial Polysilicon encapsulation process, and then to the single-crystal Silicon thermos-compression bonding process with good material properties, which makes the performance of the multi-ring resonant gyroscope continuously improved, its advantages and disadvantages are analyzed. At last, the future of high technologies is prospected, the development direction of multi-ring resonant gyroscope is proposed. |
| |
| Keywords: | micromechanical ring gyroscope micromachining technology principle of standing wave precession bonding |
|
| 点击此处可从《导航与控制》浏览原始摘要信息 |
|
点击此处可从《导航与控制》下载全文 |
|
