| 抗辐照通用扩展SiP芯片设计 |
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| 作者姓名： | 毛臻 程利甫 蒋长顺 马加林 |
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| 作者单位： | 中国电子科技集团公司第五十八研究所,上海航天计算机技术研究所,中国电子科技集团公司第五十八研究所,中国电子科技集团公司第五十八研究所 |
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| 摘 要： | 研究微小卫星综合电子系统的SiP技术实现方法。首先介绍微小卫星综合电子系统结构的组成和采用SiP技术的必要性，然后对综合电子系统进行功能模块划分，并对其通用扩展模块进行详细的SiP设计，包括抗辐照器件选型、原型验证、SiP原理图、基板管壳一体化设计、建模仿真、制造加工、实装测试验证等，通过SiP技术实现了一种星载综合电子系统中通用扩展SiP芯片产品，经过实际验证测试，在保证模块功能和性能的前提下，整体模块重量从230 g减轻到48 g，体积由180 mm?130 mm?17 mm减小到46 mm?46 mm?8 mm，很好地满足了星载功能模块小型化、轻量化设计需求。
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| 关 键 词： | 微小卫星 微系统 抗辐照 通用扩展 |
| 收稿时间： | 2021/5/13 0:00:00 |
| 修稿时间： | 2021/9/8 0:00:00 |
Radiation-resistant universal and extensible chip based on SiP |
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| Authors: | MAO Zhen CHENG Lifu JIANG Changshun and MA Jialin |
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| Affiliation: | China Electronics Technology Group Corporation No Research Institute,Shanghai Aerospace Electronic Technology Institute,China Electronics Technology Group Corporation No Research Institute,China Electronics Technology Group Corporation No Research Institute |
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| Abstract: | This paper proposed the System in Package technology implementation about integrated electronic system in micro-satellite. Firstly, the composition of integrated electronic system in micro-satellite has been introduced. Then the necessity of System in Package application in micro-satellite has been proposed. The general extension module in the satellite-based electronic system has been realized through dividing the overall system into functional modules, then detailed design have been carried out about the module. After verification, all function have been realized. At the same time, the overall module weight have been reduced from 230 g to 48 g, and the volume has been reduced from 180 mm?130 mm?17 mm to 46 mm?46 mm?8 mm, which satisfies the requirements of miniaturization and lightweight design of the micro-satellite. |
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| Keywords: | Micro-satellite System in Package Radiation-resistant General extension module |
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