基于TSV的星载微系统设计与可靠性实现 |
| |
作者姓名: | 张庆学 赵国良 王艳玲 匡乃亮 李宝霞 杨宇军 |
| |
作者单位: | 西安微电子技术研究所,西安微电子技术研究所,西安微电子技术研究所,西安微电子技术研究所,西安微电子技术研究所,西安微电子技术研究所 |
| |
基金项目: | 国家重大科技专项课题(2017ZX01011101-005) |
| |
摘 要: | 基于硅通孔TSV(Through Silicon Vias)的星载微系统,通过硬件框架设计、TSV关键工艺设计、CPS仿真设计、全流程测试及可靠性研究,最终在全国产化高温共烧陶瓷HTCC(High-Temperature Co-fired Ceramics)管壳内集成了抗辐照海量信息处理器、抗辐照大容量存储器、抗辐照微控制器、抗辐照38译码器等器件,形成43 mm×43 mm×5.65 mm的气密性封装星载微系统,具备高可靠、高性能的处理能力以及星上常用的控制和通讯接口,可用于星上载荷信息实时处理及星务平台控制管理,可以有效替代现有的板级产品,实现星载电子系统的小型化、集成化。
|
关 键 词: | 星载微系统 TSV HTCC管壳 小型化 |
收稿时间: | 2021/10/26 0:00:00 |
修稿时间: | 2022/5/22 0:00:00 |
Design and reliability realization of spaceborne microsystem based on TSV |
| |
Authors: | ZHANG Qingxue ZHAO Guoliang WANG Yanling KANG Nailiang LI Baoxia and YANG Yujun |
| |
Affiliation: | Xi''an Institute of Microelectronics Technology,Xi''an Institute of Microelectronics Technology,Xi''an Institute of Microelectronics Technology,Xi''an Institute of Microelectronics Technology,Xi''an Institute of Microelectronics Technology,Xi''an Institute of Microelectronics Technology |
| |
Abstract: | Through hardware framework design, TSV key process design, CPS simulation design, full-process testing and reliability research based on TSV, the space-borne micro system finally integrates massive amounts of anti-irradiation information in the nationally produced HTCC shells. The processor, anti-irradiation large-capacity memory, anti-irradiation microcontroller, anti-irradiation 38 decoder and other devices form a 43 mm×43 mm×5.65 mm airtight encapsulated spaceborne micro system. This micro-system product has high-reliability, high-performance processing capabilities and common on-board control and communication interfaces. It can be used for real-time processing of on-board load information and control and management of the on-board platform. It can effectively replace existing board-level products to achieve on-board miniaturization and integration of electronic systems. |
| |
Keywords: | Spaceborne microsystems TSV HTCC shell Miniaturization |
|
| 点击此处可从《》浏览原始摘要信息 |
|
点击此处可从《》下载全文 |
|