| 航空电子限时令牌太赫兹互连的实时性能分析 |
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| 引用本文： | 李佳,李峭,左沅君,熊华钢.航空电子限时令牌太赫兹互连的实时性能分析[J].北京航空航天大学学报,2023,49(4):932-942. |
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| 作者姓名： | 李佳 李峭 左沅君 熊华钢 |
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| 作者单位： | 北京航空航天大学 电子信息工程学院，北京 100191 |
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| 基金项目： | 国家自然科学基金(62071023) |
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| 摘 要： | 在航空电子设备内部采用太赫兹通信技术实现cm级的板间或芯片互连可以减少引脚和接插件，缩小电子设备的体积，并降低维护成本。针对采用全向天线收发和开关键控（OOK）调制的近距离太赫兹通信网络，通过考虑分子吸收噪声和损耗的点到点通信链路分析，给出太赫兹信道容量计算结果；结合节点间的限时令牌多路访问协议，依据信道容量采用服务曲线模型进行最坏情况下总流量分析（TFA）和隔离流量分析（SFA）；充分考虑概率保证下应用层通信任务的突发度，得到限时令牌太赫兹互连的实时性能分析方法。案例研究表明：相较于时分多址（TDMA）方式，基于限时令牌协议的无冲突多路访问机制可以适应物理层容量和应用层负载的随机变化，保证了更小的延迟，有利于实现航空电子芯片间和板间的太赫兹互连组网和实时通信。
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| 关 键 词： | 航空电子 实时通信 太赫兹通信 网络演算 限时令牌网络 |
| 收稿时间： | 2021-06-10 |
Real-time performance analysis on Terahertz interconnection with timed token protocol in avionics |
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| Affiliation: | School of Electronics and Information Engineering，Beihang University，Beijing 100191，China |
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| Abstract: | Using Terahertz communication technology to achieve centimeter level inter-board/chip interconnection in avionics can reduce pins and connectors, electronic equipment volume, and maintenance costs. For the short-range Terahertz communication network with omni-directional antenna transceiver and on-off keying (OOK) modulation, the calculation results of Terahertz channel capacity are given by analyzing the point-to-point communication link considering the molecular absorption noise and loss. Combined with the timed token multi-access protocol between nodes, and according to the channel capacity, the service curve model is used to analyze the total flow analysis (TFA) and separate flow analysis (SFA) in the worst case. The real-time performance analysis method of time limited token Terahertz interconnection is obtained by fully considering the burst degree of application layer communication task with probability guarantee. The case study shows that, compared with time division multiple access (TDMA), the collision free multiple access mechanism based on time limited token protocol can adapt to the random changes of physical layer capacity and application layer load, ensure less delay, and is conducive to the realization of Terahertz Interconnection Networking and real-time communication between avionics chips and boards. |
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