| 基于高效垂直互连的X频段三维交叉合路网络 |
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| 作者姓名： | 付浩 刘德喜 祝大龙 齐伟伟 |
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| 作者单位： | 北京遥测技术研究所 |
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| 摘 要： | 针对射频微波系统小型化、一体化、低成本设计需求,利用HFSS软件3D建模仿真研究微波毫米波多层板高密度垂直互连技术,对比不同结构参数的频率特性,在结构上通过加载层间焊盘改善特定频段内传输性能,在DC^20GHz内回波损耗小于–20dB。基于该高效垂直互连技术,实现32路信号输入4波束输出交叉网络3D垂直合成,体积仅为125mm×30mm×1.8mm,经测试带内插损≤10.95dB,驻波比≤1.4,较好地实现了X频段合路输出功能。
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| 关 键 词： | 垂直互连 HFSS仿真 匹配优化 合路交叉网络 |
X-band 3D composite crossover network based on efficient vertical interconnection |
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| Authors: | Fu Hao Liu Dexi Zhu Dalong Qi Weiwei |
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| Affiliation: | (Beijing Research Institute of Telemetry,Beijing 100094,China) |
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| Abstract: | Aiming at the miniaturization,integration and inexpensive design requirements of RF microwave system,the high-density vertical interconnection technology of microwave millimeter wave multi-layer board is studied by HFSS software 3D modeling and simulation.The frequency characteristics of different structural parameters are compared,and the transmission performance in some frequency bands is improved by adding interlayer pads.The S11 is less than-20 dB in DC^20 GHz.Based on the high-efficiency vertical interconnection technology,3D vertical synthesis of 32-channel input 4-beam output crossover network is realized.Component network volume is only 125 mm×30 mm×1.8 mm,the S21≤–10.95 dB,VSWR≤1.4.It’s better to realize the X-band composite output function. |
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| Keywords: | Vertical interconnection HFSS simulation Match optimization Crossover network |
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