对高强度辐射场（HIRF）环境特点与干扰类型进行分析，采用理论计算、计算机仿真技术（CST）的仿真分析及实测等方法分别对某型飞机航空电子系统综合显示单元的外部强电磁辐射场孔缝耦合、场线耦合及芯片前端电路影响关键芯片的相关规律进行了研究，给出了相关设计建议。结果表明，可通过分析孔缝、场线耦合获得进入关键芯片前端电路的电磁干扰能量，再结合关键芯片前端电路网络对干扰的插入损耗分析，获得关键芯片在外部强场激励下的感应电压。

The influence of high intensity field outside of the inner key chip of an IDU(Integrated Display Unit) in a avionics system is studied. The characteristic of HIRF(High Intensity Radiated Field ) and interference type are analyzed and the theoretic computation ,CST simulation and measurement are used together in this process. Test results show that the interference will couple through holes and gaps into the cabinet and also couple by cables into the circuits of avionics equipment. The interference transfer functions of circuit before the key chip of an IDU is also explored. Thus the response voltage of key chip of an IDU from HIRF environment could be obtained.

V243.1;V351.36