Abstract: To realize an adequate heat dissipation for the integrated avionics chip under a continuous high-intensity operation, so as to avoid the noise on the electronic hot surface by homeothermy techniques, a vapor chamber equipped with the bionic wick of the tree branch vein is designed, as inspired by the structure of the plant vein, and the influence of the bifurcation structure type, the fractal series, the fractal angle, the inlet velocity and the input power on the fluid flow performance in the novel wick is studied. Then, the thermal characteristics of the vapor chamber with the leaf vein are investigated, and the temperature distributions of the two types of wicks at different inlet velocities are compared. Analytical results show that the cooling effect of the Y-type structure is better than that of the H-type structure under a low heat flux density; for a high heat flux, the turbulent flow at the bifurcation enhances the heat transfer, so the cooling efficiency of H-type structure is better. The experimental results show that the Y-type evaporation chassis has a superior heat transfer performance, while the H-type and the plane type evaporation floor tend to behave better under high-power conditions.